Research Experience for Undergraduates - SenSIP Devices and Algorithms REU

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Sponsoring College, Department, School or Center: 
School of Electrical, Computer and Energy Engineering College - SenSIP Center
Faculty Name: 
Andreas Spanias / Jennifer Blain Christen
Preferred Skills or Majors: 

-Undergraduate Students Majoring in an Engineering or Science discipline.
-US citizens or permanent residents.
-Undergraduates in good academic standing.

Closing Date: 
February 28, 2021
Location or Campus: 
Tempe Campus, Goldwater Building 650 E. Tyler Mall, Tempe, AZ 85281 The SenSIP devices and algorithms REU will run this summer of 2021 from May 17 to July 16.Given the current COVID-19 conditions, we anticipate that the REU participation will be virtual. However, if conditions improve considerably we may run a hybrid program where students choose to either come on campus or attend virtually. By the end of March, we will re-assess the situation, and also seek guidance from NSF and our university and make information available on our website.
Hours Per Week: 

Desired Academic Year: 
Project Description: 

N OPPORTUNITY FOR A 9-WEEK RESEARCH EXPERIENCE FOR UNDERGRADUATE STUDENTS is available in the area of the integrated sensor device and algorithm design. The program is sponsored by the National Science Foundation and is offered by the Sensor Signal and Information Processing Center (SenSIP) and the BioElectrical Systems and Technology (BEST) Laboratory. The REU will address STEM problems associated with sensor applications in the internet of things, health monitoring, and security. During the same period, projects will train REU students to interpret data from sensors by studying and programming machine learning algorithms, sensor fusion methods, and techniques to interpret big data sets. The program currently accepts applications in order to form a very diverse, multi-disciplinary cohort of nascent researchers for this summer. Minorities, women, and people with disabilities are especially encouraged to apply.

Application Instructions and Contact Info: 

Please apply:
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